Sony Develops World’s First Millimeter-wave Wireless Intra-Connection Technology for high speed wireless notes transfer inside electronic products

February 8, 2010 · Print This Article

Sony today announced the development of millimeter-wave wireless intra-connection technology that realizes high speed wireless details transfer inside electronic products such as television sets. By replacing physical circuitry in electronics products with high speed wireless connections, that new details transfer technology reduces the number of wired connections and minimizes IC use, to simplify the IC package and printed circuit board. Furthermore, considering the details transfer occurs without contact, that enhances the reliability of movable and detachable parts within the product.that new wireless intra-connection system is based on millimeter-wave

wireless info transfer technology.

This technology, used together with miniature antennas approximately 1mm in length, enable transmission speeds of 11Gbps by a distance of 14mm, with capability consumption of 70mW. It is possible for that distance to be extended to around 50mm using high directivity antennas. Sony will proceed with efforts to adopt that technology in a range of electronics products, while continuing its development to meet ever-increasing data-rate requirements.Sony will present that technology at ISSCC 2010 , to be held in San Francisco, California, US, from February 7th 2010.